Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) has developed the compact scriber series MS300A-LTCC. With this scriber MDI has applied glass-cutting technology cultivated over many years, to cutting small-scale substrates composed of brittle materials such as LTCCs*, and other materials.
The MS300A-LTCC will be exhibited during <The 37th Internepcon Japan>, to be held in January 2008.
*LTCC: Low Temperature Co-fired Ceramic
Background of the Development
The use of LTCC substrates in cell phones, automobiles and other applications has grown sharply in recent years. The usual process for making LTCCs requires first cutting grooves in the green sheets*, and then splitting along the grooves after firing. However, production yield was a problem due to variations in final product size. Size variation resulted from uneven contraction ratios during the substrate firing process.
MDI solved this problem using our unique deep-penetration cutting wheel -- the Penett®. The Penett® enables high-speed, dry cutting of the substrate after firing, and has led to a dramatic increase in productivity.
Furthermore, in addition to LTCCs, the MS300A-LTCC is able to cut the increasingly diverse types of glass substrates and brittle material substrates of sizes up to 300mm square.
*Green sheets: Sheets of materials comprising a mix of dielectric ceramics, glass, etc.
- Enquiries
For further information about this product, please contact MDI, below. - Mitsuboshi Diamond Industrial Co., Ltd.
- New Business Promotion Department
- Mr Keitaro Okamoto
- TEL: 06-6378-3847
- FAX: 06-6378-3851
- E-Mail : kokamoto@mitsuboshi-dia.co.jp