Mitsuboshi Diamond Industrial Co.,Ltd. (HQ Minami Kaneden 2-12-12, Suita, Osaka, President Yasuaki Miyake) has developed the new MPV-LMM-series, a hybrid patterning device equipped with mechanical and laser cutting tools for CIGS/CIS-based thin film photovoltaic cells.
With a multi-head structure that combines laser and mechanical scribing, all patterning processes of CIGS/CIS-based thin film photovoltaic cells, from P1 to P3 can be performed with a single device, an all-in-one-type especially designed to save costs and space. This device is the best choice for R&D-based process verification and test production of CIGS/CIS-based thin film photovoltaic cells.
The MPV-LMM was also displayed at the PV EXPO2010 (3.3rd - 5th Big Sight, Tokyo).
MPV-LMM-series
【Background of the development】
Compared to other types of solar cells, CIGS-based thin film photovoltaic cells are low in cost and have a high potential of conversion efficiency and are therefore considered to be the next generation of solar cells.
The American National Renewable Energy Laboratory (NREL) has achieved a conversion efficiency rate of 19.9% with small-area photovoltaic cells, but there is still a significant difference to large-area modules with an efficiency of only 13%.
There is a great loss of integration, especially because of the dead areas in the P1, P2, and P3-patterning. The key challenge will be how to reduce this loss of power generation and enhance the performance of the patterning process.
MDI has already established a technology and device for the P1, P2, and P3-patternings of CIGS-based thin film photovoltaic cells in 2007 in joint development with the National Institute of Advanced Industrial Science and Technology (AIST) and has achieved satisfactory results in R&D and mass production at many research institutes and panel makers in Japan and overseas.
As a next step, MDI will provide a complete solution for the patterning of CIGS-based thin film photovoltaic cells. Apart from the mechanical patterning of the P2 and P3-processes, MDI succeeded in the application of its sophisticated glass-cutting technology by laser-equipment to the P1-patterning process and can now offer a solution by laser-patterning.
As one of few companies worldwide that possess mechanical and laser-cutting technologies, MDI can now offer solutions for all processes from P1, P2, and P3-patterning to glass cutting by this new hybrid-type patterning device of the MPV-LMM-series.
【About MPV-LMM】
◆Characteristics
The MPV-LMM includes a standard equipment of three scribing heads, one cutting head for high-quality glass-cutting in a R&D-environment, one laser head for the P1 and one mechanical head for the P2 and P3-processes. Optionally, the number and type of scribing heads can also be modified. A wide range of other optional tools for edge isolation (P4) or bus bar patterning can also be equipped.
◆Basic specifications
Number of scribing heads： 3 (Option of additional heads possible)
① for P1 Fiber Laser x1
② for P2, P3 Mechanical tool x1
③ for glass-cutting Cutting wheel x1
・Laser-worked surface: Processing from the coated side (Optional from the glass side)
・Table: Suction type (glass)
・Panel handling: Manual (Optional automatic）
・Alignment: Automatic alignment with 2 CCD-cameras
・Others: Dust-collecting equipment
※Described specification is subject to change without prior notice
【Next plans】
Exhibition PV EXPO 2010: 03. 2010
Scheduled release date: 04. 2010
■ Further information:
For further information concerning this subject please contact:
Mitsuboshi Diamond Industrial Co.,Ltd., New Business Promotion Department
TEL：06-6378-3847