MDI 英語ニュースリリース

MDI has won against a Korean company a suit over the validity of a patent.

2011-06-23T00:28:00Z

We are pleased to announce that MDI has eventually won against a Korean company a suit over the validity of a patent which MDI owns for the glass cutter wheel (hereinafter referred to as the wheel) at the Intellectual Property High Court in Japan. In April we also won another action of annulment of the trial decision for the same patent in Japan against a Japanese company.

The first patent dispute began in 2004, when Shinhan Diamond Industrial Co., Ltd. filed a suit in Korea claiming that our patent for the wheel called Penett® was invalid. Later, we have been similarly challenged against the same patent in China, Taiwan, and Japan. Although it has been ruled invalid in China and Korea, the Japanese Intellectual Property High Court ruled otherwise and validated the patent in Japan. In short, the Japanese judicial decided that our patent was valid.

In the countries we have been sued, they all used the same evidence, the Japanese published unexamined patent applications to claim that the patent was invalid. The governments (Patent Offices) decisions, however, divided by the countries. The judicial decision in each country also varied after the Japanese Intellectual Property High Court validated the patent.

The invention for the patent is about the wheel called Penett® that creates deep vertical cracks on a sheet glass with minimal damage to the glass surface, and facilitates an easy separation of the glass. It is formed like an abacus-bead (approximately 2-mm in diameter) and has fine serrations (alternating notches and protrusions) along the ridge-line to cut a sheet glass. A conventional wheel requires two consequential steps – scribing and folding before completely separating the glass. Penett®, on the other hand, requires only one single process for a complete separation. The invention is innovative in that it speeds up production process and downsizes the equipment, largely contributing to cost reduction. Since this invention was out on the market, it has become the de facto standard for LCD cutting process.

MDI won an engineering prize for this invention from The Japan Society for Abrasive Technology in 2009. We received an ADY prize twice from FINETECH JAPAN, the largest international trade convention in the FPD industry, for our glass cutting equipment using the invented technology, namely the MPL series in 2004 and MPX series in 2009.

The same patent was also filed in the US and European countries, and it has been fully approved. On the other hand, in Korea and China, the patent was once authorized, and then later invalidated. In Taiwan, MDI appealed against the decision on the invalidity of the patent to the Supreme Court. We are now waiting to see how they ultimately rule its validity.

Japanese manufacturers are now shifting manufacturing　bases to other Asian countries, such as Korea, China and Taiwan. If there is a risk that a Japanese company’s patent once approved in foreign countries could be invalidated later, or that either administrative or judicial decision or both in such countries could be influenced by the government’s industrial policy, thus their judicial decision could come out inconsistent, any Japanese companies who are thinking of going international would become very wary of developing a plan for overseas investment.

We really hope to see for all Japanese businesses planning to go international that every country will make a just and fair as well as consistent judgment.

MDI builds new office building

2011-05-16T03:53:31Z

Mitsuboshi Diamond Industrial Co., Ltd. (below "MDI"/Headquarters: Suita City, Osaka Prefecture/President: Yasuaki Miyake) announced the decision to build a new office building in the city of Settsu, Osaka.
By spring 2012 the headquarters that is scattered over several places will be concentrated at one place to create the operations more efficiently. The new building has five floors (basement to the 4^th floor) and features environment-friendly measures such as a green area on the roof and solar-panels.

　　【Overview】

Address: Koroen 228-20, Settsu, Osaka

Date of completion: End of 4. 2012

Move-in day: Mid of 5. 2012

Total site area: 4,900㎡

Total floor area: 11,887㎡

For further information concerning this topic, please contact:

Mitsuboshi Diamond Industrial Co., Ltd.
Planning Department, Public Relations

E-Mail ： infom@mitsuboshi-dia.co.jp Tel ： 06-6378-3828

Support for the people and area affected by the earthquake

2011-04-06T04:19:01Z

Mitsuboshi Diamond Industrial Co., Ltd. has decided to support the people and area affected by the great earthquake and tsunami that hit north-east Japan on March 11^thwith a donation of 5 million Yen to the Japanese Red Cross and Ashinaga Ikuei Kai (scholarships for orphans).

While mourning for the victims, we convey our deepest condolences to their families and pray for a quick recovery of the region.

Marketing of Laser Drilling Machine for Photovoltaic Cell Glass Substrate, "MPV-LD Series"

2011-03-30T04:52:05Z

We at Mitsuboshi Diamond Industrial Co., Ltd. (Head office: Suita City, Osaka, Japan; President: Yasuaki Miyake) have developed the laser drilling machine, MPV-LD Series, by applying our advanced technology for laser-cutting of glass substrates, which we have cultivated in the FPD market, to the drilling process for wiring on photovoltaic cell glass substrates, etc.

Background of development

Aiming at achievement of "the total solution for processing of CIGS thin-film photovoltaic cells," we are eagerly engaged in development of the laser patterning, isolation, edge deletion, etc. in addition to the conventional mechanical patterning. In the CIGS photovoltaic cell processing processes, the holes for wiring are mainly drilled by a mechanical means before the patterning process. However, the symptom that a crack generated at drilling causes the glass substrate to be crashed in a subsequent process has occurred, and it has become a major factor causing deterioration of the yield. Having noticed on an earlier occasion the market needs for the drilling process immediately before wiring, we have established a non-contact and completely dry drilling technique by applying the laser micro plasma processing*1.

Since the laser micro plasma processing only removes the outer periphery of hole, it drastically reduces glass cullets and particles in comparison with the conventional mechanical means. Also, our laser micro plasma processing employing green (532 nm) as the laser wave length features the ability for penetrating a glass substrate and processing it from the bottom side toward the top side. (Patent pending) This processing has succeeded in providing the following advantages.

(1) Facilitating removal of glass cullets and particles and making the upper side (layer side) of glass substrates free from glass cullets and particles sticking on them.
(2) Drastically reducing the chipping of inside surface of hole and the breakage of wires and enhancing the glass strength at the edges of inside surface of hole.
(3) Preventing any drilled holes from being tapered.
(4) Realizing high precision of bore of hole and enabling shortening the tact time of processing*2.

*1 Laser micro plasma processing: Processing technology utilizing micro plasma generated by laser multiphoton absorption.
*2 We have realized the processing tact time of approximately 10 seconds or shorter/hole when we drill a 4-mm diameter hole through a 2-mm thick soda lime glass substrate. However, the processing tact time may differ with the conditions of the surface.

Furthermore, the high-speed drilling process has allowed us to develop an innovative hybrid machine which simultaneously executes the edge deletion processing and drilling processing, by incorporating the drilling mechanism into the laser edge deletion machine conventionally used in the process immediately subsequent to the drilling process. This innovation has realized the space-saving and cost-saving mounting of drilling mechanism.
We are expanding the application of our laser drilling system to glass substrates for various crystalline silicon photovoltaic cells and thin-film photovoltaic cells including bifacial photovoltaic cells and double glass photovoltaic cells in addition to the CIGS photovoltaic cells, aiming at expansion of the sales of our laser drilling system to the overseas and domestic markets of photovoltaic cells.

Contact us

Regarding this subject, contact us at the following headquarters through phone, fax and e-mail.
Photovoltaic Business Headquarters, Mitsuboshi Diamond Industrial Co., Ltd.
Phone: +81-6-6378-3847; Fax: +81-6-6378-3851; E-mail: contact2@mitsuboshi-dia.co.jp

March 14th 2011　About the earthquake

2011-03-14T07:42:37Z

Our hearts go out to all people who have been affected by the great earthquake that occurred on March 11^th at 14.45h off the coast of Miyagi prefecture.

While mourning for the victims, we convey our deepest condolences to their families and pray for a quick recovery of the region.

Fortunately, our contractors and our 2 factories in Nagano, Iida and Tateshina, are all　　operating normally.

MDI establishes new "Electronic Components Business Headquarters"

2010-07-05T07:36:36Z

Mitsuboshi Diamond Ind. Co., Ltd

MDI has established the new Electronic Components Business Headquarters as described below:

1. Address:

1-9-23 Esaka-Cho, Suita City, Osaka 564-0063, Japan

2. Telephone:

Sales Department: 06-6378-3810

Production Engineering Department: 06-6378-3825

Business Promotion Department: 06-6378-3830

Development Engineering Department: 06-6378-3861

3. Fax:

For each department: 06-6378-3875

4. Starting date:

07. 05th 2010 (Mon)

■For further information please contact:

Mitsuboshi Diamond Industrial Co., Ltd.
Planning Department, Public Relations Manager Mrs. Seno
〒564-0044　
Minami Kaneden 2-12-12, Suita-City, Osaka Pref
TEL: 06-6378-3828 FAX: 06-6378-3851
E-mail: infom@mitsuboshi-dia.co.jp

Complete merger of Laser Solutions CO., Ltd.

2010-04-01T10:43:55Z

Mitsuboshi Diamond Ind. Co., Ltd.

Mitsuboshi Diamond Industrial Co., Ltd. (below "MDI" / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) announced at an extraordinary shareholders' meeting held on February 25th 2010, the resolution to merge the Laser Solutions Co., Ltd. (below "LAS") a 100% owned subsidiary of MDI, completely together with MDI..

LAS have been conducting sales and development of LED production facilities before. The new fully-owned subsidiary will now promote the unification of this business and concentrate the management resources on this area.

Method of merger
Absorption merger by the merging corporation Mitsuboshi Diamond Ind. Co., Ltd.

■For further information concerning this topic please contact:
Mitsuboshi Diamond Industrial Co., Ltd.
Planning Department, Public Relations Manager Mrs. Seno
〒564-0044　
Minami Kaneden 2-12-12, Suita-City, Osaka Pref
TEL: 06-6378-3828 FAX: 06-6378-3851
E-mail: infom@mitsuboshi-dia.co.jp

MDI releases new MPV-LMM series - Hybrid mechanical patterning device for CIGS/CIS-based thin film photovoltaic cells

2010-02-24T05:31:32Z

Mitsuboshi Diamond Industrial Co.,Ltd. (HQ Minami Kaneden 2-12-12, Suita, Osaka, President Yasuaki Miyake) has developed the new MPV-LMM-series, a hybrid patterning device equipped with mechanical and laser cutting tools for CIGS/CIS-based thin film photovoltaic cells.
With a multi-head structure that combines laser and mechanical scribing, all patterning processes of CIGS/CIS-based thin film photovoltaic cells, from P1 to P3 can be performed with a single device, an all-in-one-type especially designed to save costs and space. This device is the best choice for R&D-based process verification and test production of CIGS/CIS-based thin film photovoltaic cells.
The MPV-LMM was also displayed at the PV EXPO2010 (3.3rd - 5th Big Sight, Tokyo).

MPV-LMM-series

【Background of the development】

Compared to other types of solar cells, CIGS-based thin film photovoltaic cells are low in cost and have a high potential of conversion efficiency and are therefore considered to be the next generation of solar cells.
The American National Renewable Energy Laboratory (NREL) has achieved a conversion efficiency rate of 19.9% with small-area photovoltaic cells, but there is still a significant difference to large-area modules with an efficiency of only 13%.
There is a great loss of integration, especially because of the dead areas in the P1, P2, and P3-patterning. The key challenge will be how to reduce this loss of power generation and enhance the performance of the patterning process.
MDI has already established a technology and device for the P1, P2, and P3-patternings of CIGS-based thin film photovoltaic cells in 2007 in joint development with the National Institute of Advanced Industrial Science and Technology (AIST) and has achieved satisfactory results in R&D and mass production at many research institutes and panel makers in Japan and overseas.
As a next step, MDI will provide a complete solution for the patterning of CIGS-based thin film photovoltaic cells. Apart from the mechanical patterning of the P2 and P3-processes, MDI succeeded in the application of its sophisticated glass-cutting technology by laser-equipment to the P1-patterning process and can now offer a solution by laser-patterning.
As one of few companies worldwide that possess mechanical and laser-cutting technologies, MDI can now offer solutions for all processes from P1, P2, and P3-patterning to glass cutting by this new hybrid-type patterning device of the MPV-LMM-series.

【About MPV-LMM】

◆Characteristics

The MPV-LMM includes a standard equipment of three scribing heads, one cutting head for high-quality glass-cutting in a R&D-environment, one laser head for the P1 and one mechanical head for the P2 and P3-processes. Optionally, the number and type of scribing heads can also be modified. A wide range of other optional tools for edge isolation (P4) or bus bar patterning can also be equipped.

◆Basic specifications

Number of scribing heads： 3 (Option of additional heads possible)

　　　① for P1 Fiber Laser x1
② for P2, P3 Mechanical tool x1
③ for glass-cutting Cutting wheel x1

・Laser-worked surface: Processing from the coated side (Optional from the glass side)
・Table: Suction type (glass)
・Panel handling: Manual (Optional automatic）
・Alignment: Automatic alignment with 2 CCD-cameras
・Others: Dust-collecting equipment

※Described specification is subject to change without prior notice

【Next plans】

Exhibition PV EXPO 2010: 03. 2010
Scheduled release date: 04. 2010

■ Further information:

For further information concerning this subject please contact:
Mitsuboshi Diamond Industrial Co.,Ltd., New Business Promotion Department
TEL：06-6378-3847

Newly built "New Iida factory" in Iida, Nagano started Operation

2009-10-13T02:05:55Z

Mitsuboshi Diamond Industrial Co., Ltd. (HQ: Suita, Osaka, President: Yasuaki Miyake) is producing facilities for processing glass, FPD, and other brittle materials in the Iida factory. To increase the capacity of production, the “New Iida Factory” has been established in Iida in Nagano prefecture and will start running from October 13th 2009. The purpose of the new factory is to establish a system of production in a clean environment that features automatic inspection and packing in order to increase the capacity of production and reduce the costs.

An overview of the new plant

An overview of the new plant
Location	1840-1 Mikkaichiba Iida City, Nagano Prefecture
Site area	About 16,500m²
Total floor space	Factory:4,250m² Offices:1,065m² 1st Floor – 600m² 2nd Floor – 465m²
No. of employees	About 100
Production items	Processing tools for glass, FPDs and other brittle materials
Certifications to be obtained	ISO 14001:2004 ISO 9001:2000 OHSAS 18001:2007

Environment

As a part of MDI´s environmental measures,

the new factory will feature a solar panel

for photovoltaic power generation on the roof with

an output of 30kw, that is able to cover the whole energy

demand of the office building.

【For further information contact】

Mitsuboshi Diamond Industrial Co.,Ltd. Planning Department

〒564-0044　 Minami Kaneden 2-12-12, Suita-City, Osaka Pref.

TEL : 06-6378-3828 FAX : 06-6378-3851

E-mail : infom@mitsuboshi-dia.co.jp

MDI acquires the Laser Solutions Co.,Ltd

2009-06-24T00:58:41Z

On June 23^rd , 2009, Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) announced at a board meeting the acquisition of all shares of the Laser Solutions Co.,Ltd. a 100% subsidiary of the Dainippon Screen MFG.Co.Ltd. (Code-No 7335, registered at the 1^st section of the Tokyo and Osaka stock exchange). The acquisition will become effective from June 30^th2009.

1．　Purpose of the acquisition

　By fusing together LAS’s Laser processing technology with MDI’s laser scribing and other applications, MDI expects to capture a larger share of the spreading LED-market and an expansion of their business activities.

2．　Company outline

　　（of the acquired company）　　

　　・Company nameoooo：　Laser Solutions Co.,Ltd.

　　・Field of businessoo0：　Development, manufacturing and sales of Laser-micro processing

　　・Field of businessoo0：　devices and inspection devices with high-precision visual systems.

　　・Establishedoo0oooo：　04. 03^rd 2000

　　・Head officeofficeffice：　Keihan Bus Jujo Bldg., 5 Minami-Ishida-cho, Higashi-Kujo,

　　・Head officeofficeffice：　Minami-ku, Kyoto 601-8033 Jp

　　・President oooooooo：　Tetsuo Hoki

　　・Capitalizationooo0o ：　90 Million Yen

　・Holding company　　：　Dainippon Co.,Ltd. 100％

【For further information contact】

Mitsuboshi Diamond Industrial Co.,Ltd.

Planning Department, Public Relations Manager Seno

〒564-0044　

Minami Kaneden 2-12-12, Suita-City, Osaka Pref.

TEL : 06-6378-3828 FAX : 06-6378-3851

E-mail : infom@mitsuboshi-dia.co.jp

Panel cutting device "MPX-Series" awarded with the ADY 2009 award for best production equipment

2009-03-27T00:58:17Z

Mitsuboshi Diamond Industrial Co.,Ltd. (MDI) has received the 14th “Advanced display of the year“ (ADY 2009) award in the category of best production equipment for the flipless cutting system “MPX-series“. The awards ceremony was held during the 19th “Fine Tech Japan”-Exhibition from April 15th -17th 2009 in the Tokyo Big Sight.

FINE TECH JAPAN

MDI obtains ISO 14001:2004 and OHSAS 18001:2007 certification simultaneously at all places of business in Japan

2008-10-23T03:36:02Z

2008 October 23
Mitsuboshi Diamond Industrial Co., Ltd.
Yasuaki Miyake

Following ISO 9001:2000 certification Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) has obtained ISO 14001:2004 and OHSAS 18001:2007 certification for all business places in Japan.

ISO 14001:2004 is an international standard that prescribes processes for management and improvement of environmental performance by organizations, based on observance of legal requirements. The concept forming the framework of ISO 14001 is "establishment of environmental policy", "implementation and management of the policy", "checks and corrective action", and "review by top management". The objective is ongoing reduction of negative environmental impact, using a system of responsibility.

OHSAS 18001:2007 is an international certification standard aimed at reducing accidents, raising compliance with legal requirements and generally improving occupational health and safety. Safety and health management previously implemented locally is reorganized into a systematic framework forming part of corporate management.

MDI has introduced a management system based on ISO 14001:2004 and OHSAS 18001:2007. We are committed to safeguarding the safety and health of all people in our company. At the same time, we are building a framework for implementation of global environment-friendly corporate activities, and for ongoing improvement of their effectiveness.

Additional Information

OHSAS 18001:2007: Occupational Health and Safety Management System
ISO 14001:2004: Environmental Management Systems

Enquiries

Mitsuboshi Diamond Industrial Co., Ltd.
Administration Department (Public Relations)
Ms Seno
E-mail: rseno@mitsuboshi-dia.co.jp
TEL : 06-6378-3828
FAX : 06-6378-3850

Total shipment of FPD substrate cutting devices by Mitsuboshi Diamond Industrial reaches 3,000

2008-08-05T13:24:48Z

Mitsuboshi Diamond Industrial Co., Ltd.

Total global shipment by Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) reached 3,000 in July 2008.

MDI began making FPD substrate cutting machinery in 1977. In 1982, we established a production enhancement system for inline machines. Today, we are providing the world's leading panel manufacturers with a wide range of products, from stand-alone units to inline systems.

With the growing size of FPD substrates in recent years, MDI research and development has concentrated on satisfying cutting requirements for large-scale substrates. Our R&D has resulted in cutting machinery for 10th-generation substrates.

By 1997, we had shipped 1,000 units. Our shipment volume has grown steadily, with 2,000 units shipped by 2004, and the 3,000th unit shipped in July 2008.
The 3,000th unit shipped was the MPX2200 Series -- part of the Inline Flipless Cutting System. The specifications for this unit were designed for 7.5-generation (1950x2250) panels.

MDI is continually striving to contribute to the FPD market. We are steadily building upon a product and technical services system that meets the needs of customers to the greatest possible extent.

Additional Information

MDI was founded in 1935 as a manufacturer of glass cutters. In 1977 we developed a scriber for LCD glass substrates. This marked our full-scale entry to the market for liquid crystal manufacturing equipment. Today, MDI is established as the leading manufacturer of cutting machinery for liquid crystal panels.

Enquiries

Mitsuboshi Diamond Industrial Co., Ltd.
Administration Department (Public Relations)
Ms Seno
E-mail: rseno@mitsuboshi-dia.co.jp
TEL: 06-6378-3828
FAX: 06-6378-3850

MDI begins joint research with the National Institute of Advanced Industrial Science and Technology (AIST)

2008-02-26T01:00:00Z

Cutting machinery and technology for CIGS solar cell glass

Joint research with the National Institute of Advanced Industrial Science and Technology (AIST / Germany)

Mitsuboshi Diamond Industrial and the Photovoltaic Power Generation Center Compound Thin Film Team (at the National Institute of Advanced Industrial Science and Technology in Germany) are engaged in joint research relating to glass-cutting technology for CIGS solar cells. The purpose of the joint research is “Development of essential technology for integration of high-efficiency CIGS solar cells, and technological development contributing to efficient processing, thereby achieving highly efficient CIGS solar cells and cost reductions.”

Download PDF file here

Release of a compact scriber for LTCCs - the

2008-01-03T11:18:06Z

Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) has developed the compact scriber series MS300A-LTCC. With this scriber MDI has applied glass-cutting technology cultivated over many years, to cutting small-scale substrates composed of brittle materials such as LTCCs*, and other materials.
The MS300A-LTCC will be exhibited during <The 37th Internepcon Japan>, to be held in January 2008.

*LTCC: Low Temperature Co-fired Ceramic

Background of the Development

The use of LTCC substrates in cell phones, automobiles and other applications has grown sharply in recent years. The usual process for making LTCCs requires first cutting grooves in the green sheets*, and then splitting along the grooves after firing. However, production yield was a problem due to variations in final product size. Size variation resulted from uneven contraction ratios during the substrate firing process.
MDI solved this problem using our unique deep-penetration cutting wheel -- the Penett®. The Penett® enables high-speed, dry cutting of the substrate after firing, and has led to a dramatic increase in productivity.

Furthermore, in addition to LTCCs, the MS300A-LTCC is able to cut the increasingly diverse types of glass substrates and brittle material substrates of sizes up to 300mm square.

*Green sheets: Sheets of materials comprising a mix of dielectric ceramics, glass, etc.

Enquiries For further information about this product, please contact MDI, below.

Mitsuboshi Diamond Industrial Co., Ltd.
New Business Promotion Department
Mr Keitaro Okamoto
TEL: 06-6378-3847
FAX: 06-6378-3851
E-Mail : kokamoto@mitsuboshi-dia.co.jp

MDI 英語 ニュースリリース