Mitsuboshi Diamond Industrial Co.,Ltd. will participate in the 37th Internepcon Japan, Exhibition of Technologies for Electronics Manufacturing, held on Tokyo Big Sight Japan from January 16th to 18th 2008.
Looking back to many years of experience of cutting glass and brittle materials, this year the spotlight will be on cutting and processing of LTCC (Low Temperature Co-fired Ceramics) and we will present the special purpose machine MS300A-LTCC.
In recent years, we developed a technology of high-speed cutting of sintered LTCC panels, that has become widely used especially for the application in cars or mobile phones, with our unique deep penetration cutter wheel tip "penett&". At this years exhibition you will have the chance to see a demonstration of this technology. We are looking forward to welcome many visitors.
>> MS300A-LTCC
>> INTERNEPCON JAPAN |
| 
| 
| 
| 
