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2008/01/03
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Mitsuboshi Diamond Industrial Co.,Ltd. (Main Office: Suita, Osaka, President: Yasuaki Miyake) has applied its glass scribing technology that it has developed for many years, to cut small sized brittle LTCC (Low Temperature Co-fired Ceramics) panels and developed the compact scriber series MS300A-LTCC. The new product will be first presented on the 37th Internepcon Japan.
Background of the development
In recent years, the usage of LTCC panels for mobile phones or car equipment has rapidly increased. The usual process is a method of cutting a groove in the green sheet*1, firing and cutting afterwards. Due to an unequal contraction percentage within the firing process, the yield ration of the final product size has become a problem. There Mitsuboshi Diamond Industrial Co.,Ltd. has developed a method of cutting the panel after firing by a high speed dry process applying its unique deep penetration cutter wheel tip "penett®" and realized a dramatic increase of productivity.
Besides, the MS300A also fulfills the requirements for various cutting processes of brittle materials and compact sized panels of an angle not over 300mm, other than LTCC.
*1 Green sheet: Sheet-shaped material comprising a mix of dielectric ceramics and glass.
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Product outline of the MS300A-LTCC series |
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Applicable panel size |
Max. 300x300mm |
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Alignment function |
Auto Alignment system with cameras on 2 axes. |
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Cutting Tool |
Deep penetration cutter wheel tip "penett®" |
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Features |
Ionizer
Signal tower (3 colors) |
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Applied software |
Alignment function per 1 line
inside-outside select function per line
multiple works function (up to 16 sheets simultaneously) |
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Applicable extra
specifications |
CE specification model, automatic line |
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Contact
For further information concerning this product, please contact the undersigned contact address:
Mitsuboshi Diamond Industrial Co.,Ltd., New Business Promotion Department, Keitaro Okamoto
TEL:+81-6-6378-3847, FAX:+81-6-6378-3851, E-Mail:kokamoto@mitsuboshi-dia.co.jp |
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