Background of the development
In recent years, the usage of LTCC panels for mobile phones or car equipment has rapidly increased. The usual process is a method of cutting a groove in the green sheet*1, firing and cutting afterwards. Due to an unequal contraction percentage within the firing process, the yield ration of the final product size has become a problem. There Mitsuboshi Diamond Industrial Co.,Ltd. has developed a method of cutting the panel after firing by a high speed dry process applying its unique deep penetration cutter wheel tip "penett®" and realized a dramatic increase of productivity.
Besides, the MS300A also fulfills the requirements for various cutting processes of brittle materials and compact sized panels of an angle not over 300mm, other than LTCC.
*1 Green sheet: Sheet-shaped material comprising a mix of dielectric ceramics and glass.
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