- 【for R&D and Mass production】
Non-contact and dry processing by laser micro plasma allow drilling post patterning process. -
MDI developed Green Laser Drilling machine for CIGS glass substrate PV.
Drilling from under-surface at glass substrate provides less chipping and particle onto layer side.
- Facilitating removal of glass cullets and particles and making the upper side (layer side) of glass substrates free from glass cullets and particles sticking on them.
- Drastically reducing the chipping of inside surface of hole and the breakage of wires and enhancing the glass strength at the edges of inside surface of hole.
- Preventing any drilled holes from being tapered.
- Realizing high precision of bore of hole and enabling shortening the tact time of processing*.
* We have realized the processing tact time of approximately 10 seconds or shorter/hole when we drill a 4-mm diameter hole through a 2-mm thick soda lime glass substrate. However, the processing tact time may differ with the conditions of the surface.
Standard specifications
| Glass Thickness | 1.0mm-5.0mm |
|---|---|
| Wave Length | 532nm |
| Positioning Precision | ±0.2mm |
| Hole size | φ3～6mm |
| Operating System | PC Windows® base |
| Utility | Power AC200 3-phase |
| CDA 0.5MPa 30L/min | |
| Through-put | ≦15 seconds *1 |
| MODEL | MPV800-LD | MPV1200-LD | MPV1400-LD | MPV1700-LD |
|---|---|---|---|---|
| Glass Size | 800×500mm MAX | 1,200×600mm MAX | 1,400×1,100mm MAX | 1,700×700mm MAX |
| Dimensions (W×D×H) | 2,000×1,800×2,000mm | 2,400×1,900×2,000mm | 2,600×2,400×2,000mm | 2,900×2,000×2,000mm |
| Weight | 4,000kg | 4,500kg | 4,500kg | 5,000kg |
*1 φ4mm, 1.8mm thickness soda-lime glass, 1 hole drilling