Mitsuboshi Diamond Industrial Co., Ltd. (below "MDI" / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) announced at an extraordinary shareholders' meeting held on February 25th 2010, the resolution to merge the Laser Solutions Co., Ltd. (below "LAS") a 100% owned subsidiary of MDI, completely together with MDI..

LAS have been conducting sales and development of LED production facilities before. The new fully-owned subsidiary will now promote the unification of this business and concentrate the management resources on this area.

Method of merger
Absorption merger by the merging corporation Mitsuboshi Diamond Ind. Co., Ltd.

■For further information concerning this topic please contact:
Mitsuboshi Diamond Industrial Co., Ltd.
Planning Department, Public Relations Manager Mrs. Seno
〒564-0044　
Minami Kaneden 2-12-12, Suita-City, Osaka Pref
TEL: 06-6378-3828   FAX: 06-6378-3851
E-mail: infom@mitsuboshi-dia.co.jp

【Background of the development】

Compared to other types of solar cells, CIGS-based thin film photovoltaic cells are low in cost and have a high potential of conversion efficiency and are therefore considered to be the next generation of solar cells.
The American National Renewable Energy Laboratory (NREL) has achieved a conversion efficiency rate of 19.9% with small-area photovoltaic cells, but there is still a significant difference to large-area modules with an efficiency of only 13%.
There is a great loss of integration, especially because of the dead areas in the P1, P2, and P3-patterning. The key challenge will be how to reduce this loss of power generation and enhance the performance of the patterning process.
MDI has already established a technology and device for the P1, P2, and P3-patternings of CIGS-based thin film photovoltaic cells in 2007 in joint development with the National Institute of Advanced Industrial Science and Technology (AIST) and has achieved satisfactory results in R&D and mass production at many research institutes and panel makers in Japan and overseas.
As a next step, MDI will provide a complete solution for the patterning of CIGS-based thin film photovoltaic cells. Apart from the mechanical patterning of the P2 and P3-processes, MDI succeeded in the application of its sophisticated glass-cutting technology by laser-equipment to the P1-patterning process and can now offer a solution by laser-patterning.
As one of few companies worldwide that possess mechanical and laser-cutting technologies, MDI can now offer solutions for all processes from P1, P2, and P3-patterning to glass cutting by this new hybrid-type patterning device of the MPV-LMM-series.

【About MPV-LMM】

◆Characteristics

The MPV-LMM includes a standard equipment of three scribing heads, one cutting head for high-quality glass-cutting in a R&D-environment, one laser head for the P1 and one mechanical head for the P2 and P3-processes. Optionally, the number and type of scribing heads can also be modified. A wide range of other optional tools for edge isolation (P4) or bus bar patterning can also be equipped.

◆Basic specifications

Number of scribing heads： 3 (Option of additional heads possible)

　　　① for P1 Fiber Laser x1
② for P2, P3 Mechanical tool x1
③ for glass-cutting Cutting wheel x1

・Laser-worked surface: Processing from the coated side (Optional from the glass side)
・Table: Suction type (glass)
・Panel handling: Manual (Optional automatic）
・Alignment: Automatic alignment with 2 CCD-cameras
・Others: Dust-collecting equipment

※Described specification is subject to change without prior notice

【Next plans】

Exhibition PV EXPO 2010: 03. 2010
Scheduled release date: 04. 2010

■ Further information:

For further information concerning this subject please contact:
Mitsuboshi Diamond Industrial Co.,Ltd., New Business Promotion Department
TEL：06-6378-3847

An overview of the new plant

Environment

As a part of MDI´s environmental measures,

the new factory will feature a solar panel

for photovoltaic power generation on the roof with

an output of 30kw, that is able to cover the whole energy

demand of the office building.

【For further information contact】

Mitsuboshi Diamond Industrial Co.,Ltd. Planning Department

〒564-0044　 Minami Kaneden 2-12-12, Suita-City, Osaka Pref.

TEL : 06-6378-3828 FAX : 06-6378-3851

E-mail : infom@mitsuboshi-dia.co.jp

 1．　Purpose of the acquisition

　By fusing together LAS’s Laser processing technology with MDI’s laser scribing and other applications, MDI expects to capture a larger share of the spreading LED-market and an expansion of their business activities.

2．　Company outline

　　（of the acquired company）　　

　　・Company nameoooo：　Laser Solutions Co.,Ltd.

　　・Field of businessoo0：　Development, manufacturing and sales of Laser-micro processing

　　・Field of businessoo0：　devices and inspection devices with high-precision visual systems.

　　・Establishedoo0oooo：　04. 03^rd 2000

　　・Head officeofficeffice：　Keihan Bus Jujo Bldg., 5 Minami-Ishida-cho, Higashi-Kujo,

　　・Head officeofficeffice：　Minami-ku, Kyoto 601-8033 Jp

　　・President oooooooo：　Tetsuo Hoki

　　・Capitalizationooo0o ：　90 Million Yen

　・Holding company　　 ：　Dainippon Co.,Ltd. 100％

【For further information contact】

Mitsuboshi Diamond Industrial Co.,Ltd.

Planning Department, Public Relations Manager Seno

〒564-0044　

Minami Kaneden 2-12-12, Suita-City, Osaka Pref.

TEL : 06-6378-3828   FAX : 06-6378-3851

E-mail : infom@mitsuboshi-dia.co.jp

       FINE TECH JAPAN

Following ISO 9001:2000 certification Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) has obtained ISO 14001:2004 and OHSAS 18001:2007 certification for all business places in Japan.

ISO 14001:2004 is an international standard that prescribes processes for management and improvement of environmental performance by organizations, based on observance of legal requirements. The concept forming the framework of ISO 14001 is "establishment of environmental policy", "implementation and management of the policy", "checks and corrective action", and "review by top management". The objective is ongoing reduction of negative environmental impact, using a system of responsibility.

OHSAS 18001:2007 is an international certification standard aimed at reducing accidents, raising compliance with legal requirements and generally improving occupational health and safety. Safety and health management previously implemented locally is reorganized into a systematic framework forming part of corporate management.

MDI has introduced a management system based on ISO 14001:2004 and OHSAS 18001:2007. We are committed to safeguarding the safety and health of all people in our company. At the same time, we are building a framework for implementation of global environment-friendly corporate activities, and for ongoing improvement of their effectiveness.

Enquiries

• Mitsuboshi Diamond Industrial Co., Ltd.
• Administration Department (Public Relations)
• Ms Seno
• E-mail: rseno@mitsuboshi-dia.co.jp
• TEL : 06-6378-3828
• FAX : 06-6378-3850

Total global shipment by Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) reached 3,000 in July 2008.

MDI began making FPD substrate cutting machinery in 1977. In 1982, we established a production enhancement system for inline machines. Today, we are providing the world's leading panel manufacturers with a wide range of products, from stand-alone units to inline systems.

With the growing size of FPD substrates in recent years, MDI research and development has concentrated on satisfying cutting requirements for large-scale substrates. Our R&D has resulted in cutting machinery for 10th-generation substrates.

By 1997, we had shipped 1,000 units. Our shipment volume has grown steadily, with 2,000 units shipped by 2004, and the 3,000th unit shipped in July 2008.
The 3,000th unit shipped was the MPX2200 Series -- part of the Inline Flipless Cutting System. The specifications for this unit were designed for 7.5-generation (1950x2250) panels.

MDI is continually striving to contribute to the FPD market. We are steadily building upon a product and technical services system that meets the needs of customers to the greatest possible extent.

Enquiries

• Mitsuboshi Diamond Industrial Co., Ltd.
• Administration Department (Public Relations)
• Ms Seno
• E-mail: rseno@mitsuboshi-dia.co.jp
• TEL: 06-6378-3828
• FAX: 06-6378-3850

Joint research with the National Institute of Advanced Industrial Science and Technology (AIST / Germany)

Mitsuboshi Diamond Industrial and the Photovoltaic Power Generation Center Compound Thin Film Team (at the National Institute of Advanced Industrial Science and Technology in Germany) are engaged in joint research relating to glass-cutting technology for CIGS solar cells. The purpose of the joint research is “Development of essential technology for integration of high-efficiency CIGS solar cells, and technological development contributing to efficient processing, thereby achieving highly efficient CIGS solar cells and cost reductions.”

Download PDF file here

*LTCC: Low Temperature Co-fired Ceramic

Background of the Development

The use of LTCC substrates in cell phones, automobiles and other applications has grown sharply in recent years. The usual process for making LTCCs requires first cutting grooves in the green sheets*, and then splitting along the grooves after firing. However, production yield was a problem due to variations in final product size. Size variation resulted from uneven contraction ratios during the substrate firing process.
MDI solved this problem using our unique deep-penetration cutting wheel -- the Penett®. The Penett® enables high-speed, dry cutting of the substrate after firing, and has led to a dramatic increase in productivity.

Furthermore, in addition to LTCCs, the MS300A-LTCC is able to cut the increasingly diverse types of glass substrates and brittle material substrates of sizes up to 300mm square.

*Green sheets: Sheets of materials comprising a mix of dielectric ceramics, glass, etc.

Enquiries
For further information about this product, please contact MDI, below.

• Mitsuboshi Diamond Industrial Co., Ltd.
• New Business Promotion Department
• Mr Keitaro Okamoto
• TEL: 06-6378-3847
• FAX: 06-6378-3851
• E-Mail : kokamoto@mitsuboshi-dia.co.jp

Mitsuboshi Diamond International had undertaken sales of glass processing tools for substrate glass. The company was absorbed into MDI for improved efficiency of business management under a unified chain of command.
Cutting edges and tools is one of MDI's core businesses, and the aim of the merger was to rationalize this business and strengthen the business base.

Upon merger, all employees of Mitsuboshi Diamond International Co., Ltd. were transferred to MDI.

Post-merger enquiries

• Mitsuboshi Diamond Industrial Co., Ltd.
• Business Promotion Department, Sales Division, Sales Section 2
• 2-12-12 Minami-kaneden, Suita City, Osaka Prefecture 564-0044
• TEL: 06-6378-3847
• FAX: 06-6378-3851

Download PDF file here

Mitsuboshi Diamond Industrial Co., Ltd. ("MDI" below / Headquarters: Suita City, Osaka Prefecture / President: Yasuaki Miyake) and Schott AG (Headquarters: Mainz City, Germany) have signed an agreement to transfer Schott AG laser business to MDI.
With this transfer, MDI received all intellectual properties, technologies and business rights relating to Schott AG laser business.
Meanwhile, on June 1, 2005, MDI established the R&D and business promotion base MSAP * in Mainz City, Germany. The purpose of this base is to strengthen laser cutting technology relating to brittle materials, including flat panel displays.
MSAP has taken over the personnel resources and R&D facilities belonging to the former Schott Advanced Processing **.

Background and Objectives of the tie-up

In recent years, there has been rapidly rising demand for enhanced quality and increased diversity in the cutting of flat panel displays.

MDI has continued to offer new concepts in machinery and tools through cutting machinery using cutting wheels. Today, we have a leading share in the market for tools and machinery used to cut and bevel flat panel displays. At the same time, we have a leading share of the market in laser cutting equipment for mass production.
Meanwhile, Schott AG has long been involved in development of laser cutting equipment for glass. They have specialized technology and their products have been widely accepted by the market. Their market share is about equal to that of MDI.

Fusion of the unique laser process technologies of MDI and Schott AG will reinforce the power of technological development strength, and support proposal of wide-ranging technological solutions to diverse anticipated needs of customers. We will also push forward with development of solutions for new market requirements.

The Plan

Technology:

Transfer of patent rights and other intellectual properties, and related technologies

Production:

Transfer of technology and establishment of manufacturing systems by MDI

Sales:

Enhancement of distribution routes / construction of sales systems
(EU region & North America region -- MSAP / Other regions -- MDI)

* MSAP：

• Name of company
  MDI Schott Advanced Processing GmbH
• Place of business
  Am Getreidespeicher 7 Mainz 55120 Germany

** Schott Advanced Processing:

A division of Schott AG, formerly engaged chiefly in R&D of laser cutting technology for sheet glass

Download PDF file here

Cutting edges and tools is one of MDI's core businesses. The goal of integration is to strengthen the base of this core business through comprehensive reinforcement of product development and quality assurance systems, rationalization of production, and more.

Meanwhile, to disperse risk in the case of disaster, MDI will begin business at a new Osaka Plant in April. Operated by MDI's Tool Production Division*, Wako Diamond's former place of business is to be renamed the "Iida Plant." Together, the Iida Plant and the Osaka Plant will achieve reduction of production costs and ensure stability of supply to the market. Additionally, with integration all Wako Diamond employees will transfer to MDI.

* Tool Production Division:
One of a number of divisions newly established in MDI. The Tool Production Division has overall responsibility for development and manufacture of cutting edges and tools used for cutting thin sheet glass.

Post-integration enquiries

• Mitsuboshi Diamond Industrial Co., Ltd.
• Business Strategies Office
• 2-12-12 Minami-kaneden, Suita City, Osaka Prefecture 564-0044
• TEL: 06-6378-3847
• FAX: 06-6378-3851

Download PDF file here

Behind the tie-up

The rising level of technology and diversification of needs in FPD cutting over recent years have been accompanied by growing demand for prompt and appropriate response to user requirements.

With our cutting wheels and laser cutting equipment, MDI has always provided equipment and tools based on state-of-the-art concepts. We have established a leading share in the market for FPD cutting and beveling, and tools.
Meanwhile, as a member of the THK Group, Beldex has designed and manufactured special-order machinery for customers, developed FPD cutting equipment that uses vibrating head units, and more.

By fusing the unique features of tools and process technologies of each company, we aim to anticipate diverse customer needs with wide-ranging technological solutions. This tie-up will also promote cultivation of new markets.

The Plan

Technology:

Transfer of patent rights and other intellectual properties, and related technologies

Production:

Mutual supplementation of assembly operations for PDP cutting equipment

Sales:

Mutual handling of products / enhancement of distribution routes and construction of distribution systems

Enquiries

For further information on the tie-up, please contact either MDI or Beldex, as shown below

Mitsuboshi Diamond Industrial Co., Ltd.

• Business Strategies Office -- Mr Yoshitetsu Tanihata
• TEL: 06-6378-3847
• FAX: 06-6378-3851
• E-Mail: ytanibata@mitsuboshi-dia.co.jp

Beldex Corporation

• FA Division -- Mr Shoji Takahashi
• TEL: 03-5912-6981
• FAX: 03-5912-6986
• E-Mail: takahashis@beldex.co.jp

Download WORD File here