2. Technology
  3. Development supports MDI processing technology
  4. Theorization and simulation

Development supports MDI processing technology

Theorization and simulation

We have undertaken the development of brittle material processing methods by utilizing our knowledge and know-how, which we have cultivated since our founding. However, we also make a great effort to theoretically understand the processing phenomenon.
Theoretical analogy of the processing phenomenon enables us to develop processing methods for new materials with a short lead time.
Theory based simulation supports our development with a short lead time.


Observation of processing phenomenon.

A thorough observation of the current status is essential for theoretical explanation of the processing phenomenon. The results of observation from various aspects are stored, and it is presumed how these states occur theoretically.

It is also important to quantify the features of the observed images obtained by electronic microscope, etc. Observation of the internal conditions (heat, stress, etc.) of workpieces, which cannot be visually observed, is required. The results are converted into data by using special analysis methods.


Tool processing theories

Tool processing is a process method to plastically deform workpieces by contacting with a tool.

Among them, cutting is a technique used to cut brittle materials such as glass by generating cracks utilizing the plastic deformation that occurs.
For example, when scribing by pressing the scribing wheel onto the glass panel, plastic deformation occurs on the panel surface where the wheel is contacted. This generates a deep crack along the scribing line. The depth of the crack, state of the cutting surface, etc. vary depending on the wheel shape and other conditions. To achieve better processing, we have made considerable effort to theoretically understand the changes that occur in the panel and how they lead to crack generation, through experimental observations and simulations.


Laser processing theories

Laser processing involves various phenomena. During laser irradiation, different excitation states occur depending on the laser wavelength, such as excitation of electron state and excitation of oscillation state. Furthermore, a laser beam with a short pulse width may cause nonlinear phenomena such as multiphoton absorption and tunnel ionization. The excited substances are laser processed through processes such as evaporation due to temperature rise and ionization by electron separation. With various studies on these processes, there has been a gradual advance in the understanding of these processes.

For example, with regard to the thermal stress crack growth processing of glasses (glass cutting method by water jet quenching after laser heating), its cutting principle has been theoretically analyzed by simulating the internal stress state of the glass, based on the glass temperature condition during processing.



Appropriate simulation provides some important information to help us understand the processing phenomenon. Physical conditions that are difficult to observe can be figured out by simulation; for example, in tool processing, the stress distribution in the minute area of contact between the wheel and the panel, and in laser processing, the inner temperature distribution of the solid.

Since the processing of an actual physical part involves various factors, it is very difficult to understand the processing phenomenon just from the observation result. By examining the simulation result (with the conditions sorted by the computer) and the observation result together, the processing phenomenon can be understood more deeply.