{"id":1779,"date":"2024-05-21T20:17:46","date_gmt":"2024-05-21T11:17:46","guid":{"rendered":"https:\/\/www.mitsuboshidiamond.com\/eng\/?post_type=news&#038;p=1779"},"modified":"2024-09-27T20:25:24","modified_gmt":"2024-09-27T11:25:24","slug":"2024-05-21-001","status":"publish","type":"news","link":"https:\/\/www.mitsuboshidiamond.com\/eng\/news\/2024-05-21-001\/","title":{"rendered":"[Article Published] \u201cFurther Developments in the High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers\u201d"},"content":{"rendered":"<p>An article authored by one of our employees has been featured in a special issue of the *Journal of Japan Society for Abrasive Technology* titled &#8220;After Receiving the Japan Society for Abrasive Technology Technical Award.&#8221; The article highlights the progress made since receiving the 2021 award for the &#8220;Development of High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers.&#8221;<\/p>\n<div class=\"s_table\"><table border=\"2\" width=\"100%\">\n<tbody>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px; min-width: 100px;\"><strong>Title<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">Further Developments in the High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers (2)<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>Authors<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">Mitsuru Kitaichi, Yoshiyuki Asai, Toshio Fukunishi<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>Publication Date<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">January 1, 2024<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>Published in<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">*Journal of Japan Society for Abrasive Technology*, January 2024 Issue<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>URL<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\"><a title=\"Visit the official website of the Japan Society for Abrasive Technology.\" href=\"https:\/\/www.jsat.or.jp\/journal\" target=\"_blank\" rel=\"noopener\">Visit the official website of the Japan Society for Abrasive Technology.<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<p><b><span style=\"color: #20b2aa;\">* <\/span>(1) Journal of Japan Society for Abrasive Technology Vol.66 No.2 2022 FEB.56-59<\/b><br \/>\n<a href=\"\/wp-content\/uploads\/2024\/05\/66-2_\u6280\u8853\u8cde\u7d39\u4ecb\u8a18\u4e8b.pdf\">2021 Award for &#8220;Development of High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers&#8221;<\/a><\/p>\n<p><b><span style=\"color: #20b2aa;\">* <\/span>(2) Journal of Japan Society for Abrasive Technology Vol.68 No.1 2024 JAN.6-7<\/b><br \/>\n<a href=\"\/wp-content\/uploads\/2024\/05\/Vol.68_No.1\u7279\u96c6\u8a18\u4e8b.pdf\">Further Developments in the High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers<\/a><\/p>\n","protected":false},"featured_media":0,"template":"","news_category":[51],"class_list":["post-1779","news","type-news","status-publish","hentry","news_category-academic-paper-info"],"_links":{"self":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news\/1779","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/types\/news"}],"wp:attachment":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/media?parent=1779"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news_category?post=1779"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}