{"id":1835,"date":"2024-04-30T18:50:27","date_gmt":"2024-04-30T09:50:27","guid":{"rendered":"https:\/\/www.mitsuboshidiamond.com\/eng\/?post_type=news&#038;p=1835"},"modified":"2024-11-01T18:53:27","modified_gmt":"2024-11-01T09:53:27","slug":"20240430-1","status":"publish","type":"news","link":"https:\/\/www.mitsuboshidiamond.com\/eng\/news\/20240430-1\/","title":{"rendered":"[Article Published] Cleavage-Type Cutting Process for Next-Generation Power Semiconductors (SiC)"},"content":{"rendered":"<p>An article authored by our employees was published in the March 30, 2024, issue of the magazine *Monthly Automotive Technology*.<\/p>\n<div class=\"s_table\"><table border=\"2\" width=\"100%\">\n<tbody>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px; min-width: 100px;\"><strong>Title<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">Cleavage-Type Cutting Process for Next-Generation Power Semiconductors (SiC)<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>Authors<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">Asuka Misawa, Mitsuru Kitaichi<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>Publication Date<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">March 30, 2024<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>Publication<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">Monthly Automotive Technology, March Issue, Publisher: Technical Information Institute<\/td>\n<\/tr>\n<tr>\n<td style=\"vertical-align: middle; text-align: center; background-color: #dcdcdc; color: #333333; padding-top: 6px; padding-bottom: 6px;\"><strong>URL<\/strong><\/td>\n<td style=\"padding: 6px 10px 6px 10px;\">\u203bRedirects to Automotive Technology website<br \/>\n<a href=\"https:\/\/www.fujisan.co.jp\/product\/1281702973\/b\/2413449\/\" target=\"_blank\" rel=\"nofollow noopener\">Monthly Automotive Technology: Technical Information Institute<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n<p>\u25a0 You can view the article here:<br \/>\n<a href=\"https:\/\/www.mitsuboshidiamond.com\/wp-content\/uploads\/2024\/04\/\u8eca\u30c6\u30af202403-13\u3000\u6b21\u4e16\u4ee3\u30d1\u30ef\u30fc\u534a\u5c0e\u4f53-\uff08SiC\uff09-\u306e\u7d50\u6676\u3078\u304d\u958b\u578b\u5207\u65ad\u52a0\u5de5.pdf\" target=\"_blank\" rel=\"nofollow noopener\">Automotive Technology 202403: Cleavage-Type Cutting Process for Next-Generation Power Semiconductors (SiC)<\/a><\/p>\n","protected":false},"featured_media":0,"template":"","news_category":[51],"class_list":["post-1835","news","type-news","status-publish","hentry","news_category-academic-paper-info"],"_links":{"self":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news\/1835","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/types\/news"}],"wp:attachment":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/media?parent=1835"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news_category?post=1835"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}