{"id":1917,"date":"2025-04-23T19:27:42","date_gmt":"2025-04-23T10:27:42","guid":{"rendered":"https:\/\/www.mitsuboshidiamond.com\/eng\/?post_type=news&p=1917"},"modified":"2025-04-23T19:27:42","modified_gmt":"2025-04-23T10:27:42","slug":"20250423-1","status":"publish","type":"news","link":"https:\/\/www.mitsuboshidiamond.com\/eng\/news\/20250423-1\/","title":{"rendered":"[Article Published] Application of the Scribe & Break Method for Semiconductor Wafer Dicing"},"content":{"rendered":"

An article authored by our employees has been published in the April 2025 issue of the Journal of the Japan Society for Abrasive Technology.<\/p>\n

\n\n\n\n\n\n\n
Title<\/strong><\/td>\nApplication of Scribe & Break Method for Semiconductor Wafer Dicing<\/td>\n<\/tr>\n
Authors<\/strong><\/td>\nAsuka Misawa, Kumiko Murakami, Yoshiyuki Asai, Mitsuru Kitaichi<\/td>\n<\/tr>\n
Publication Date<\/strong><\/td>\nApril 1, 2025<\/td>\n<\/tr>\n
Journal<\/strong><\/td>\nJournal of the Japan Society for Abrasive Technology, April 2025 Issue<\/td>\n<\/tr>\n
URL<\/strong><\/td>\n* You will be redirected to the website of the Japan Society for Abrasive Technology.<\/a><\/td>\n<\/tr>\n<\/tbody>\n<\/table><\/div>\n","protected":false},"featured_media":0,"template":"","news_category":[51],"class_list":["post-1917","news","type-news","status-publish","hentry","news_category-academic-paper-info"],"_links":{"self":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news\/1917","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/types\/news"}],"wp:attachment":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/media?parent=1917"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news_category?post=1917"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}