{"id":2156,"date":"2025-11-20T09:30:41","date_gmt":"2025-11-20T00:30:41","guid":{"rendered":"https:\/\/www.mitsuboshidiamond.com\/eng\/?post_type=news&#038;p=2156"},"modified":"2025-11-20T09:31:24","modified_gmt":"2025-11-20T00:31:24","slug":"20251119-1","status":"publish","type":"news","link":"https:\/\/www.mitsuboshidiamond.com\/eng\/news\/20251119-1\/","title":{"rendered":"New Semiconductor Wafer Singulation System &#8220;DIALOGIC Plus+&#8221; Featured in Electronic Device Industry News(JP)"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\"><\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Mitsuboshi Diamond Industrial Co., Ltd. (MDI) is pleased to announce that our new semiconductor wafer singulation system, <strong>&#8220;DIALOGIC Plus+,&#8221;<\/strong> was featured in the November 13, 2025 issue of <em>Electronic Device Industry News<\/em> (Denchi Device Sangyo Shimbun), published by Sangyo Times, Inc.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The article highlights how DIALOGIC Plus+, which utilizes our proprietary &#8220;Scribe &amp; Break (SnB)&#8221; technology, contributes to the efficiency of semiconductor manufacturing processes and the establishment of flexible production systems.<\/p>\n\n\n\n<h3 class=\"wp-block-heading\">Key Features &amp; Advantages Highlighted<\/h3>\n\n\n\n<p class=\"wp-block-paragraph\">As noted in the coverage, DIALOGIC Plus+ represents a completely new concept in singulation systems, designed to meet the evolving needs of the semiconductor market.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>Modularity for Flexible Customization<\/strong> Each process step is designed as an independent module, allowing customers to combine them freely according to their specific applications and production plans. This modularity ensures a seamless transition from small-scale R&amp;D starts to full-scale mass production, optimizing capital investment.<\/li>\n\n\n\n<li><strong>Full Automation for Maximum Productivity<\/strong> The &#8220;Full Auto Model&#8221; integrates the entire sequence of processes\u2014from cassette loading to film lamination\/removal, expanding, and transfer\u2014within a single system. This automation minimizes operator error and achieves an approximate <strong>20% improvement in throughput<\/strong> compared to conventional models.<\/li>\n\n\n\n<li><strong>Proprietary SnB Technology<\/strong> Leveraging MDI&#8217;s decades of expertise in high-precision glass processing, the system applies our dry &#8220;Scribe &amp; Break&#8221; method to semiconductor materials, supporting high-quality chip manufacturing without the use of water.<\/li>\n<\/ul>\n\n\n\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"768\" height=\"823\" src=\"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-content\/uploads\/2025\/11\/E99BBBE5AD90E38387E38390E382A4E382B9E794A3E6A5ADE696B0E8819E_251113E68EB2E8BC89_DLP_03-1-768x823-1.png\" alt=\"\" class=\"wp-image-2157\" title=\"\" srcset=\"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-content\/uploads\/2025\/11\/E99BBBE5AD90E38387E38390E382A4E382B9E794A3E6A5ADE696B0E8819E_251113E68EB2E8BC89_DLP_03-1-768x823-1.png 768w, https:\/\/www.mitsuboshidiamond.com\/eng\/wp-content\/uploads\/2025\/11\/E99BBBE5AD90E38387E38390E382A4E382B9E794A3E6A5ADE696B0E8819E_251113E68EB2E8BC89_DLP_03-1-768x823-1-280x300.png 280w\" sizes=\"auto, (max-width: 768px) 100vw, 768px\" \/><\/figure>\n\n\n\n<div style=\"height:60px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h3 class=\"wp-block-heading\">Related Information<\/h3>\n\n\n\n<ul class=\"wp-block-list\">\n<li><strong>DIALOGIC Plus+ Product Page :<\/strong> <a href=\"https:\/\/www.mitsuboshidiamond.com\/eng\/dialogic-plus\/\" target=\"_blank\" rel=\"noopener\" title=\"\">https:\/\/www.mitsuboshidiamond.com\/eng\/dialogic-plus\/<\/a><\/li>\n<\/ul>\n\n\n\n<p class=\"wp-block-paragraph\"><strong>About Mitsuboshi Diamond Industrial Co., Ltd. (MDI)<\/strong> Founded in 1935, MDI celebrates its 90th anniversary in 2025. Guided by our corporate philosophy, &#8220;Walking with a view to the future,&#8221; we contribute to the development of the electronics industry through our unique cutting and processing technologies.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"featured_media":2035,"template":"","news_category":[51],"class_list":["post-2156","news","type-news","status-publish","has-post-thumbnail","hentry","news_category-academic-paper-info"],"_links":{"self":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news\/2156","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/types\/news"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/media\/2035"}],"wp:attachment":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/media?parent=2156"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news_category?post=2156"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}