{"id":2244,"date":"2026-09-30T18:49:27","date_gmt":"2026-09-30T09:49:27","guid":{"rendered":"https:\/\/www.mitsuboshidiamond.com\/eng\/?post_type=news&#038;p=2244"},"modified":"2026-09-30T18:55:59","modified_gmt":"2026-09-30T09:55:59","slug":"20260930_1","status":"publish","type":"news","link":"https:\/\/www.mitsuboshidiamond.com\/eng\/news\/20260930_1\/","title":{"rendered":"Announcement of Our Participation in SEMICON West 2026"},"content":{"rendered":"\n<p class=\"wp-block-paragraph\">MDI Advanced Systems USA Inc., a group company of Mitsuboshi Diamond Industrial Co., Ltd., will exhibit at SEMICON West 2026, held from Tuesday, October 13, to Thursday, October 15, 2026, in San Francisco, California, USA.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">SEMICON West 2026 is an international exhibition that brings together companies, engineers, researchers, and business leaders in the semiconductor and microelectronics industries to showcase the latest technologies, products, and solutions.<\/p>\n\n\n\n<div style=\"height:38px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Exhibit Overview<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">At our booth, we plan to showcase wafer processing samples produced using SnB (Scribe and Break) technology, along with products and technologies for processing semiconductor and compound semiconductor materials.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">Visitors will be able to explore the precision processing technologies developed by the Mitsuboshi Diamond Industrial Group through actual processed samples, products, and videos introducing our equipment.<\/p>\n\n\n\n<div style=\"height:49px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">What Is SnB Processing?<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">SnB stands for \u201cScribing and Breaking.\u201d<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">It is a method of separating brittle materials, such as wafers, by forming a scribe line on the material surface and then breaking the material along that line.<\/p>\n\n\n\n<p class=\"wp-block-paragraph\">The Mitsuboshi Diamond Industrial Group proposes separation processes tailored to the properties and processing requirements of various brittle materials, including compound semiconductor materials.<\/p>\n\n\n\n<div style=\"height:50px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Processing Challenges You Can Discuss With Us<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Evaluating methods for wafer separation<\/li>\n\n\n\n<li>Assessing processing methods for compound semiconductor materials<\/li>\n\n\n\n<li>Determining scribing and breaking conditions for new materials<\/li>\n\n\n\n<li>Discussing prototype processing or sample processing<\/li>\n\n\n\n<li>Considering processing methods suitable for mass production<br><br>At the exhibition, our team will be available to discuss wafer and brittle material separation, processing evaluations, prototype processing, and potential applications in mass production.<\/li>\n<\/ul>\n\n\n\n<div style=\"height:39px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Planned Exhibit Highlights<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>Wafer processing samples produced using SnB<\/li>\n\n\n\n<li>OZREE glass cutter<\/li>\n\n\n\n<li>Videos introducing SnB equipment<\/li>\n<\/ul>\n\n\n\n<div>Exhibit contents are subject to change.<\/div>\n\n\n\n<div style=\"height:42px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">SEMICON West 2026 Event Details<\/h2>\n\n\n\n<div>Event<br>\nSEMICON West 2026<\/div>\n\n\n\n<div>Dates<br>\nTuesday, October 13 \u2013 Thursday, October 15, 2026<\/div>\n\n\n\n<div>Venue<br>\nMoscone Center<br>\nSan Francisco, California, USA<\/div>\n\n\n\n<div>Exhibitor<br>\nMDI Advanced Systems USA Inc.<\/div>\n\n\n\n<div>Exhibition Hall<br>\nSouth Hall<\/div>\n\n\n\n<div>Booth Number<br>\n165<\/div>\n\n\n\n<div style=\"height:42px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Technical Consultations and Meetings During the Event<\/h2>\n\n\n\n<div>If you would like to arrange a meeting during SEMICON West 2026, please contact us through the Mitsuboshi Diamond Industrial Co., Ltd. inquiry form. Our team will be available to discuss challenges involving wafer separation, processing evaluations for compound semiconductor materials, and prototype processing.<\/div>\n\n\n\n<div>We invite you to visit the MDI Advanced Systems USA Inc. booth to learn more about our processing technologies and solutions.<\/div>\n\n\n\n<div>We look forward to welcoming you.<\/div>\n\n\n\n<h3>Related Information<\/h3>\n\n\n\n<div><a href=\"https:\/\/expo.semi.org\/west2026\/\" target=\"_blank\" rel=\"nofollow noopener\">SEMICON West 2026 Official Website<\/a><\/div>\n\n\n\n<div><a href=\"https:\/\/www.mitsuboshidiamond.com\/contact\/\" target=\"_blank\" rel=\"noopener\">Mitsuboshi Diamond Industrial Co., Ltd. Technical Consultations and Inquiries<\/a><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"featured_media":0,"template":"","news_category":[6],"class_list":["post-2244","news","type-news","status-publish","hentry","news_category-exhibition"],"_links":{"self":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news\/2244","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news"}],"about":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/types\/news"}],"wp:attachment":[{"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/media?parent=2244"}],"wp:term":[{"taxonomy":"news_category","embeddable":true,"href":"https:\/\/www.mitsuboshidiamond.com\/eng\/wp-json\/wp\/v2\/news_category?post=2244"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}