[Presentation] Technical Information Institute Co., Ltd. “Low-Damage Semiconductor Dicing and Latest Trends”
On May 1, 2024, Mitsuboshi Diamond Industrial Co., Ltd. announced that it will present at the seminar titled “Low-Damage Semiconductor Dicing and Latest Trends,” hosted by Technical Information Institute Co., Ltd., on Tuesday, July 2, 2024. The demand for power devices using compound semiconductors (SiC) has been expanding in recent years, leading to an increased need for faster SiC wafer cutting speeds. As traditional dicing methods are insufficient, new cutting techniques with entirely different processing mechanisms are being sought.
In this seminar, we will introduce the Scribe & Break method, which enables high-speed cutting without kerf loss and operates as a fully dry process. We will discuss the processing principles, applications in SiC wafer cutting, and processing quality. We encourage you to attend.
Presentation Details
Title: “Cleavage-Type Cutting of Compound Semiconductor (SiC) Crystals”
Presenter: Asuka Misawa, Mitsuboshi Diamond Industrial Co., Ltd.
Seminar Overview
- Date and Time: Tuesday, July 2, 2024, 10:30–16:00
- Venue: Live broadcast via Zoom (no on-site lectures)
- Technical Information Institute Co., Ltd. URL: http://www.jlps.gr.jp/index.html
