Equipment Products
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| Equipment Profile | Supported Substrate Sizes | Supported Substrate Thickness | Processing speed | Processing Precision |
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| This simultaneous cutting equipment, evolved from traditional MPX equipment, is capable of handling G8.5 mother glass. It has 4 special characteristics. (1) A flat conveyor belt that eliminates transfers and synchronization shifts (2) Breakless use in combination with MDI high penetration edge (Penett) (3) Smallest footprint in G8.5 cell scribe history (30% less than predecessor) (4) Reducing misalignment by integration of scribe unit and material feeding unit |
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| [MAGX-LD2500wCC] G8 2,200×2,500mm | [Invested Substrate Thickness] Single Panel 0.4 - 1.1 mm bonded substrate (same thickness as CF or TFT) | [Scribe Head Feed Rate] Max. 1,000mm/s | ±40μm | |
| High Precision Simultaneous Cutting Line System Supports the growing size of substrates by scribing large TFT substrates from the top and bottom simultaneously. |
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| [MPL2500] Max. G8 2,200×2,500mm | [Single Panel] 0.4mm-1.1mm [Bonded] 0.8mm-2.2mm | [Scribe Head Feed Rate] Max. 600mm/s | ||
| Scriber that cuts the panel port This equipment cuts the port and glass from the CF surface or the glass and port from the TFT surface following lighting inspection. |
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| [MTC5732] Max. 750×1,300mm | [Bonded] 0.8 mm - 2.2 mm (TFT thickness: 0.4 mm - 1.1 mm) | [Scribe Head Feed Rate] Max. 500mm/s | ±40μm | |
| Scribing is now possible with precision of ±20μ! The demand for scribing precision is rising along with the trend toward slim smart phone bezels. Increasing mechanical rigidity of the frame, motor, and beam, and installing high precision software has enabled high prevision scribing. |
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| [MSTH900] Max. 730×920mm | [Single Panel] 0.4mm～1.1mm [Bonded] 0.8mm～2.2mm | [Scribe Head Feed Rate] Max. 500mm/s | ±20μm | |
| Achieve economical productivity with multi-head equipment suitable for small application mass production Automatic operation allows each head to move on the shortest cycle, and allows different cut settings for each and every head. We provide cutting solutions to match the number of heads installed, for every diversifying applications. |
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| [MM500] Max. 500mm×500mm [MM700] Max. 560mm×680mm [MM900] Max. 730mm×920mm | [Single Panel] 0.4mm-1.1mm [Bonded] 0.8mm-2.2mm | [Scribe Head Feed Rate] Max. 500mm/s | ±40μm | |
| A bar type break machine that completely penetrates vertical cracks made by the scribing wheel. It is an especially important tool for raising screen quality and strength. The MB series makes smooth, precision X/Y breaks with table θ rotation and automatic alignment functions. The break mechanism and camera are of solid construction, composed from a separate beam. |
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| [MB500] Max. 500mm×500mm [MB700] Max. 560mm×680mm [MB900] Max. 730mm×920mm | [Single Panel] 0.4mm-1.1mm [Bonded] 0.8mm-2.2mm | - | - | |
| The world's first forming scriber. • Reduces cycle time by scribing with multiple heads at the same time. • Forming Scriber MP Series Multi-head Type |
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| [MMP500] Max. 500mm×500mm [MMP700] Max. 560mm×680mm [MMP900] Max. 730mm×920mm | [Single Panel] 0.4mm-1.1mm [Bonded] 0.8mm-2.2mm | [Scribe Head Feed Rate] Max. 500mm/s | [Straight Lines] ±40μm [Curved Lines] ±100μm （R4 and up） |
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| Offering the best laser process solution from a wide range of choices! Provides laser processing for glass, resin, compound materials and more! Uses a powerful laser engine and specially designed optical engine to perform micro-processing, forming, patterning, and more. » High Speed, High Precision Processing High precision processing at high throughput, made possible by equipping newly developed high speed synchronous control systems » Low Cost Achieve desired performance with powerful processing engines, and reduce cost by only choosing necessary features |
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| 300×300mm | - | [Shaft Speed] XY Shaft 1000 (mm/s) | ||
| Suitable as an entry model for R&D use Installed with the same head mechanism as mass production models, enabling high quality patterning. Customizable to meet your demands. << Customizable Parameters >> • Substrate Size • Substrate Absorption • Patterning Tool Pressurizing Method • Alignment • Other parameters can be changed as necessary |
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