Mitsuboshi Diamond Industrial to Present on Glass Substrate Dicing Technology at Japan Technology & Information Center Seminar

SETTSU, OSAKA, JAPAN – Mitsuboshi Diamond Industrial Co., Ltd. (MDI) today announced that it will deliver a presentation at the seminar titled “Development Trends, Manufacturing Processes, and Processing Technology of Glass Substrates,” hosted by the Japan Technology & Information Center on Wednesday, July 30, 2025.

The “Scribe and Break” method is a high-speed, dry process for dicing substrates made of brittle materials, such as glass. This method has been widely adopted and has a proven track record in the dicing process for Liquid Crystal Displays (LCDs). More recently, it has also gained significant attention as an effective dicing method for semiconductor substrates.

This presentation will provide a detailed explanation of cutting technologies for glass substrates, with a primary focus on the “Scribe and Break” method.

Lecture Information

• Title: ‘Dicing Technology for Glass Substrates’
• Speaker: Mr. Hiroyuki Tomimoto, Mitsuboshi Diamond Industrial Co., Ltd.

Event Outline

• Date & Time:
  Wednesday, July 30, 2025, 15:40 – 16:50 (Japan Standard Time)
• Venue:
  Live stream only. Please note that an archived version for on-demand viewing will not be available.
• Organizer & URL:
  Japan Technology & Information Center: https://www.gijutu.co.jp/doc/s_507235.htm