Technical Paper on Advanced Semiconductor Processing on TechOnline
OSAKA, Japan – August 19, 2025 – Mitsuboshi Diamond Industrial Co., Ltd. (MDI) is pleased to announce that its technical paper, “Novel Die Singulation Technique for Compound Semiconductors,” has been published on the leading technical information website, TechOnline, for a limited time.
The paper highlights MDI’s unique Scribe and Break (SnB) process for the singulation of advanced compound semiconductor materials, including SiC, GaN, and GaAs. This innovative technique offers a highly productive, precise, and cost-effective solution, contributing to the next generation of environmentally conscious semiconductor manufacturing.
Since its founding, MDI has leveraged its expertise in brittle material processing to pursue innovation, with a strategic focus on expanding into the semiconductor industry. Guided by our corporate philosophy, “Walking with a View to the Future,” we are committed to advancing our technology to meet the evolving needs of the market.
The technical paper is available for viewing at the following link:
Publication Details:
- Website: TechOnline
- Title: Novel Die Singulation Technique for Compound Semiconductors
- URL: https://www.techonline.com/tech-papers/novel-die-singulation-technique-for-compound-semiconductors/
About Mitsuboshi Diamond Industrial Co., Ltd. Founded in 1935, Mitsuboshi Diamond Industrial Co., Ltd. has established itself as a leading manufacturer of advanced processing equipment and tools for brittle materials. With a legacy of innovation and an unwavering commitment to quality, MDI provides cutting-edge solutions for industries including flat panel displays, semiconductors, solar cells, and electronic components. The company’s unique Scribe and Break (SnB) technology is revolutionizing the manufacturing of next-generation devices.
