[Article Published] “Further Developments in the High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers”
An article authored by one of our employees has been featured in a special issue of the *Journal of Japan Society for Abrasive Technology* titled “After Receiving the Japan Society for Abrasive Technology Technical Award.” The article highlights the progress made since receiving the 2021 award for the “Development of High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers.”
| Title | Further Developments in the High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers (2) |
| Authors | Mitsuru Kitaichi, Yoshiyuki Asai, Toshio Fukunishi |
| Publication Date | January 1, 2024 |
| Published in | *Journal of Japan Society for Abrasive Technology*, January 2024 Issue |
| URL | Visit the official website of the Japan Society for Abrasive Technology. |
* (1) Journal of Japan Society for Abrasive Technology Vol.66 No.2 2022 FEB.56-59
2021 Award for “Development of High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers”
* (2) Journal of Japan Society for Abrasive Technology Vol.68 No.1 2024 JAN.6-7
Further Developments in the High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers
