[Article Published] Cleavage-Type Cutting Process for Next-Generation Power Semiconductors (SiC)
An article authored by our employees was published in the March 30, 2024, issue of the magazine *Monthly Automotive Technology*.
| Title | Cleavage-Type Cutting Process for Next-Generation Power Semiconductors (SiC) |
| Authors | Asuka Misawa, Mitsuru Kitaichi |
| Publication Date | March 30, 2024 |
| Publication | Monthly Automotive Technology, March Issue, Publisher: Technical Information Institute |
| URL | ※Redirects to Automotive Technology website Monthly Automotive Technology: Technical Information Institute |
■ You can view the article here:
Automotive Technology 202403: Cleavage-Type Cutting Process for Next-Generation Power Semiconductors (SiC)
