Silicon Carbide （SiC） Materials ＆ Devices Workshop 2024
Mitsuboshi Diamond Industrial Co., Ltd. will present a lecture on compound semiconductor device wafer cutting technology at the SiC Workshop hosted by Arkansas University in the United States on August 12-13, 2024.
■Silicon Carbide （SiC） Materials ＆ Devices Workshop 2024
【Term】 Monday ＆ Tuesday, August 12-13, 2024 (Reception August 11th, 6:00pm)
【Place】 Hosted by the University of Arkansas Fayetteville, AR
■Lecture Information
【Title】New and Innovative die singulation technology for Compound Semiconductors with Zero kerf loss and completely no damage on the side wall
【Presenter】 SHIOSAKI YOSHIRO
Detail here SiC + X Workshop 2024 (google.com)
https://www.mitsuboshidiamond.com/dialogic/
