Latest Trends in Wafer Dicing and Cutting Technology for SiC Power Semiconductors

MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. will be giving a [Live Stream/Web Seminar] on Monday, July 7, 2025.
In this seminar, titled “Latest Trends in Wafer Cleaving and Dicing Technologies for SiC Power Semiconductors,” we will provide an in-depth explanation of the latest technologies and their applications.

• Lecture Information
  Organizer: AndTech Co., Ltd.
  Seminar Name: SiC Power Semiconductor Cleaving and Dicing
  Lecturer: Mitsuru Kitaichi
  Lecture 3: Crystal Cleavage-Type Cutting of Compound Semiconductors (SiC)
  Time: Monday, July 7, 2025, 15:35-16:35(JST)
  Venue: This is a course that can be viewed on your computer at your office or home.

https://andtech.co.jp/seminars/1f0313d3-6c92-67b4-a862-064fb9a95405http://www.jlps.gr.jp/index.html