New Semiconductor Wafer Singulation System “DIALOGIC Plus+” Featured in Electronic Device Industry News(JP)
Mitsuboshi Diamond Industrial Co., Ltd. (MDI) is pleased to announce that our new semiconductor wafer singulation system, “DIALOGIC Plus+,” was featured in the November 13, 2025 issue of Electronic Device Industry News (Denchi Device Sangyo Shimbun), published by Sangyo Times, Inc.
The article highlights how DIALOGIC Plus+, which utilizes our proprietary “Scribe & Break (SnB)” technology, contributes to the efficiency of semiconductor manufacturing processes and the establishment of flexible production systems.
Key Features & Advantages Highlighted
As noted in the coverage, DIALOGIC Plus+ represents a completely new concept in singulation systems, designed to meet the evolving needs of the semiconductor market.
- Modularity for Flexible Customization Each process step is designed as an independent module, allowing customers to combine them freely according to their specific applications and production plans. This modularity ensures a seamless transition from small-scale R&D starts to full-scale mass production, optimizing capital investment.
- Full Automation for Maximum Productivity The “Full Auto Model” integrates the entire sequence of processes—from cassette loading to film lamination/removal, expanding, and transfer—within a single system. This automation minimizes operator error and achieves an approximate 20% improvement in throughput compared to conventional models.
- Proprietary SnB Technology Leveraging MDI’s decades of expertise in high-precision glass processing, the system applies our dry “Scribe & Break” method to semiconductor materials, supporting high-quality chip manufacturing without the use of water.
Related Information
- DIALOGIC Plus+ Product Page : https://www.mitsuboshidiamond.com/eng/dialogic-plus/
About Mitsuboshi Diamond Industrial Co., Ltd. (MDI) Founded in 1935, MDI celebrates its 90th anniversary in 2025. Guided by our corporate philosophy, “Walking with a view to the future,” we contribute to the development of the electronics industry through our unique cutting and processing technologies.
