[Thank You] Gratitude for Visiting SEMICON Japan 2025
We would like to sincerely thank everyone who visited the Mitsuboshi Diamond Industrial Co., Ltd. (MDI) booth at “SEMICON Japan 2025” held last week.
During the event, we showcased our “DIALOGIC” and “DIALOGIC PLUS+” series of wafer dicing equipment designed for compound semiconductors (such as SiC and GaN), alongside our environmentally friendly dry processing technology (SnB method). We were delighted to have the opportunity to exchange views with numerous industry experts regarding the challenges and possibilities of next-generation semiconductor manufacturing.
If you have any questions regarding our exhibits or would like to discuss specific processing requirements, please do not hesitate to contact us via our website.
Inquiries about the above products and services
To contact us through our website, please use the “Contact Us” button below.
