Announcement of Lecture at the Abrasive Technology Conference (ABTEC 2025)
MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD. presented a lecture on the study of the scribing phenomenon of SiC wafers at the Abrasive Technology Conference (ABTEC), an academic conference organized by the Japan Society for Abrasive Technology (JSAT), held from Wednesday, September 3 to Friday, September 5, 2025.
Lecture Overview
- Date & Time: Thursday, September 4, 2025
- Venue: Senriyama Campus, Kansai University
- Title: The Influence of Scribing Direction relative to the Off-Angle on the Scribing Quality of SiC Wafers
- Presenter: Maki Tanaka, MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
- Content: A study on the phenomenon of chipping that occurs during the scribing of SiC wafers, utilizing theoretical calculations.
Conference Overview (ABTEC 2025)
Organizer: Japan Society for Abrasive Technology (JSAT)
This conference is held to facilitate the collection and exchange of the latest information on removal processing technologies, with a focus on abrasive machining, and to promote interaction among engineers and researchers.
Fields Covered: Abrasive machining, removal processing technology, tools, machine tools, measurement and evaluation technologies, and other related fields.
URL:
https://www.scoop-japan.com/kaigi/abtec
