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2025.04.23
[Article Published] Application of the Scribe & Break Method for Semiconductor Wafer Dicing
2024.10.23
[Lecture] 2024 Academic Year New Glass Graduate School
2024.10.23
[Lecture] International Conference ISAAT 2024
2024.05.21
[Article Published] “Further Developments in the High-Efficiency, High-Quality Cutting Process and Dedicated Tools for Compound Semiconductor (SiC) Wafers”
2024.05.14
[Presentation & Paper] 30th Symposium on “Microjoining and Assembly Technologies in Electronics” – Creating New Value to Support the Electronics Industry –
2024.04.30
[Article Published] Cleavage-Type Cutting Process for Next-Generation Power Semiconductors (SiC)

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