MDI Processing Technologies
MDI's contribution to the society through innovative processing technologies for brittle materials.
Brittle materials such as glass are continuously evolving. Since our foundation, we have been working towards the development of tools for refined glass cutting. Based on our long cultivated knowledge and expertise, we have developed innovative technologies for cutting and drilling of very hard materials such as sapphire and alumina, as well as for cutting ever-evolving glass materials.
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Scribe and Break Processing
Scribe and break (S & B) processing is a cutting method that utilizes the characteristics of brittle materials. Let us introduce the features of S & B processing by MDI, which has evolved from the conventional...
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Patterning Process for Perovskite
Our patterning technology is used for forming integrated structures in perovskite solar cells.
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Scribe dicing of compound semiconductor materials _SnB
SnB has also widely been used for cutting hard brittle materials, such as LCD glass substrates. We at MDI have extended the application range to singulation compound semiconductor materials by developing original scribing wheels and special laser...
