Exhibition at the 11th Advanced Power Semiconductor Symposium

Mitsuboshi Diamond Industrial Co., Ltd. will exhibit at the “11th Advanced Power Semiconductor Symposium,” held from Sunday, November 24, to Tuesday, November 26, 2024, at G Messe Gunma.

At the event, we will showcase our semiconductor wafer chip-making technology, the “SnB (Scribe & Break) Method,” integrated into a compact system of the “DIALOGIC Series.”

Overview
Event Dates: November 24 (Sun) – 26 (Tue), 2024 (*No booth operation on November 24 due to preparation day.)
Venue: G Messe Gunma
Host: Advanced Power Semiconductor Division, The Japan Society of Applied Physics
Booth: A-02 (Hall A)

Exhibit Highlights
Innovative Chip-Making Technology for Advanced Semiconductor Devices Using Traditional Methods
– SiC wafers processed into chips using MDI’s proprietary “SnB (Scribe & Break) Method.”

Learn more about the “DIALOGIC” Series.

For details about the 11th Advanced Power Semiconductor Symposium, please visit:
[https://annex.jsap.or.jp/adps/scrm11/index.html]

We kindly invite you to visit our booth at the event.

Inquiries about the above products and services

To contact us through our website, please use the “Contact Us” button below.