Equipment Products

Equipment ProfileSupported Substrate SizesSupported Substrate ThicknessProcessing speedProcessing Precision

MAGX-LD Series



This simultaneous cutting equipment, evolved from traditional MPX equipment, is capable of handling G8.5 mother glass.
It has 4 special characteristics.
(1) A flat conveyor belt that eliminates transfers and synchronization shifts
(2) Breakless use in combination with MDI high penetration edge (Penett)
(3) Smallest footprint in G8.5 cell scribe history (30% less than predecessor)
(4) Reducing misalignment by integration of scribe unit and material feeding unit

FPD

Scribe

Mechanical

[MAGX-LD2500wCC] G8 2,200×2,500mm[Invested Substrate Thickness] Single Panel 0.4 - 1.1 mm bonded substrate (same thickness as CF or TFT)[Scribe Head Feed Rate] Max. 1,000mm/s±40μm

MPL Series



High Precision Simultaneous Cutting Line System
Supports the growing size of substrates by scribing large TFT substrates from the top and bottom simultaneously.

FPD

Scribe

Mechanical

[MPL2500] Max. G8 2,200×2,500mm[Single Panel] 0.4mm-1.1mm
[Bonded] 0.8mm-2.2mm
[Scribe Head Feed Rate] Max. 600mm/s

MTC Series


Scriber that cuts the panel port
This equipment cuts the port and glass from the CF surface or the glass and port from the TFT surface following lighting inspection.

FPD

Scribe

Mechanical

[MTC5732] Max. 750×1,300mm[Bonded] 0.8 mm - 2.2 mm (TFT thickness: 0.4 mm - 1.1 mm)[Scribe Head Feed Rate] Max. 500mm/s±40μm

LCM Series



Laser scriber using non-contact cutting with a CO2 laser.
• Microcrack free strong screen
• Maintains cullet-free high level of cleanliness
* Laser cutting equipment best seller MDLC series successor model

FPD

Scribe

Laser

[LCM300] Max. 300mm×300mm
[LCM900] Max. 730mm×920mm
[Single Panel] 0.4mm~1.1mm[Scribe Head Feed Rate] Max. 500mm/s±40μm

MMGL Series



Multi-head scriber using green lasers for laser plasm microprocessing.
We support any shapes, including boring, circular cut, elliptical cut, curved cut.

FPD

Forming

Laser

[MMGL500] Max. 500×500mm[Single Panel] ~1.8mm[Scribe Head Feed Rate] Max. 500mm/s[Center Position Accuracy] ±25μm
[Hole Shape Variation] ±25μm

MSTH Series



Scribing is now possible with precision of ±20μ!
The demand for scribing precision is rising along with the trend toward slim smart phone bezels. Increasing mechanical rigidity of the frame, motor, and beam, and installing high precision software has enabled high prevision scribing.

FPD

Scribe

Mechanical

[MSTH900] Max. 730×920mm[Single Panel] 0.4mm~1.1mm
[Bonded] 0.8mm~2.2mm
[Scribe Head Feed Rate] Max. 500mm/s±20μm

MM Series



Achieve economical productivity with multi-head equipment suitable for small application mass production
Automatic operation allows each head to move on the shortest cycle, and allows different cut settings for each and every head. We provide cutting solutions to match the number of heads installed, for every diversifying applications.

Glass

Scribe

Mechanical

[MM500] Max. 500mm×500mm
[MM700] Max. 560mm×680mm
[MM900] Max. 730mm×920mm
[Single Panel] 0.4mm-1.1mm
[Bonded] 0.8mm-2.2mm
[Scribe Head Feed Rate] Max. 500mm/s±40μm

MB Series


A bar type break machine that completely penetrates vertical cracks made by the scribing wheel.
It is an especially important tool for raising screen quality and strength.
The MB series makes smooth, precision X/Y breaks with table θ rotation and automatic alignment functions. The break mechanism and camera are of solid construction, composed from a separate beam.

Glass

Scribe

Mechanical

[MB500] Max. 500mm×500mm
[MB700] Max. 560mm×680mm
[MB900] Max. 730mm×920mm
[Single Panel] 0.4mm-1.1mm
[Bonded] 0.8mm-2.2mm
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MMP Series



The world's first forming scriber.
• Reduces cycle time by scribing with multiple heads at the same time.
• Forming Scriber MP Series Multi-head Type

Glass

Forming

Mechanical

[MMP500] Max. 500mm×500mm
[MMP700] Max. 560mm×680mm
[MMP900] Max. 730mm×920mm
[Single Panel] 0.4mm-1.1mm
[Bonded] 0.8mm-2.2mm
[Scribe Head Feed Rate] Max. 500mm/s[Straight Lines] ±40μm
[Curved Lines] ±100μm (R4 and up)

LPM Series



Offering the best laser process solution from a wide range of choices!
Provides laser processing for glass, resin, compound materials and more!
Uses a powerful laser engine and specially designed optical engine to perform micro-processing, forming, patterning, and more.
» High Speed, High Precision Processing
 High precision processing at high throughput, made possible by equipping newly developed high speed synchronous control systems
» Low Cost
 Achieve desired performance with powerful processing engines, and reduce cost by only choosing necessary features

Glass

Electronic Parts

Other

Forming

Boring

Laser

300×300mm-[Shaft Speed] XY Shaft 1000 (mm/s)

MCS6-200LD


Achieves highly efficient cutting of sintered ceramic substrates.

● High quality      : Substrate edge without thermal effects, debris and chipping
● High efficiency     :High speed / dry processing are realized. Additionally no kerf-loss.
● Convenience      :Adaptable to various materials with simple tool change and load change.
● Installation environment :Assist gas / shielding of laser light are not required. In addition, dust can be hardly generated.
● Reduction of wasted time:Reduce unnecessary standby time with a dual-arm robot for transport

Semiconductor/Electronic Parts

Scribe

Mechanical

75x75 ~ 200x200 mmMax. 4 mm[Scribe Speed]
Max. 300 mm/s
± 50 μm

T6 Series



Makes smooth, super high precision X/Y scribes using our unique optical system and automatic alignment features
The T6 series is brittle material processing laser equipment designed mainly for the LED industry.
It achieves a higher grade and faster workability than the previous RAPYULAS series.
[Merits]
• New laser compatible with high luminance LEDs
• Much faster than older models

Semiconductor/Electronic Parts

Scribe

Laser

2~6inch (/8inch ring)-[Scribe Speed] Max. 500mm/s-[Shaft Configuration] Head X, Table Y, Head Z (+2 shaft galvanometer)
[Repeat Position Accuracy] < 1μm

LS Series



High throughput dry process
• Greatly improves productivity by cutting post-firing substrates with a high speed dry process.
(Eliminates previously necessary post-processing, such as V-groove cutting and polishing)
• Even compatible with substrates that warp after firing, using the warped scribe feature
• Besides LTCC, also compatible with 300mm angle or less glass substrates, and brittle material cutting

Semiconductor/Electronic Parts

Scribe

Mechanical

270×270mm0.4~1.1mm[Scribe Speed] Max. 500mm/s±20μm

HB Series



A bar type break machine that completely penetrates vertical cracks made by the scribing wheel or laser. It is an especially important tool for raising screen quality and strength.
The HB series makes smooth, precision X/Y breaks with table θ rotation and automatic alignment functions. The break mechanism and camera are of solid construction, composed from a separate beam.

Semiconductor/Electronic Parts

Break

Mechanical

Max. 150×150mm
Min. 10×10mm
Max. 3.0mmMax. 100mm/s-

LB Series



A tabletop breaker useful for various brittle materials, with an MDI original Break Plate installed
High quality processing performed by a semiautomatic breaker, equipped with a precision camera-based alignment feature. The small footprint and reasonable cost are perfect for R&D applications

Semiconductor/Electronic Parts

Break

Mechanical

Max. 4inch (/6inch ring)Max. 3.0mm25mm/s-

MPV-MS Series



High precision patterning produces minimized film peeling in the narrow space, thereby reducing dead area
Long-selling glass cutting equipment refined for solar cell patterning use.
Our uniquely developed and manufactured patterning tools provide optimal P2/P3 patterning for all CIGS substrates.

Thin-film Solar Cells

Patterning

Mechanical

[MPV300-MS] Max. 300×300mm
[MPV500-MS] Max. 500×500mm
1.0mm~4.0mmPatterning Speed Max. 500mm/sPatterning Width 30~100μm

MPV-MM Series



High precision patterning produces minimized film peeling in the narrow space, thereby reducing dead area
Our uniquely developed and manufactured patterning tools provide optimal P2/P3 patterning for all CIGS substrates.
Mass production type mechanical patterning equipment built with all the glass cutting know-how MDI has mustered with it's 70% world share of the FPD field.

Thin-film Solar Cells

Patterning

Mechanical

[MPV1200-MM] Max. 1,200×600mm
[MPV1400-MM] Max. 1,400×1,100mm
1.0mm~4.0mmPatterning Speed Max. 1,500mm/sPatterning Width 30~100μm

MPV-HB Series



1 unit capable of patterning P1/P2/P3, making it the perfect model for R&D
The multi-head hybrid design reduces space and cost without sacrificing high performance.
CIGS use R&D system with integrated MDI laser and mechanical technology.

Thin-film Solar Cells

Patterning

Mechanical

Laser

[MPV500-LMM] Max. 500×500mm
[MPV800-LMM] Max. 800×500mm
[MPV1200-LMM] Max. 1,200×600mm
1.0mm~4.0mm[MPV500-LMM] Max. 1,000mm/s
[MPV800-LMM・MPV1200-LMM] Max. 1,500mm/s
Patterning Width
[Mechanical] 30~100μm
[Laser] 25~40μm

MPV-LD Series



Capable of post-deposition dry process boring, made contact free with the use of laser microplasma
Green laser boring equipment for CIGS solar cell wiring
Reduces chipping and adhesion of particles to the film surface by processing from the bottom surface of the glass.

Thin-film Solar Cells

Boring

Laser

[MPV800-LD] Max. 800×500mm
[MPV1200-LD] Max. 1,200×600mm
[MPV1400-LD] 1,400×1,100mm [MPV1700-LD] Max. 1,700×700mm
1.0mm~5.0mmProcessing Time ≦15 secondsProcessing Location Precision ±0.2mm

MPV-T Series

Suitable as an entry model for R&D use
Installed with the same head mechanism as mass production models, enabling high quality patterning.

Customizable to meet your demands.
<< Customizable Parameters >>
• Substrate Size
• Substrate Absorption
• Patterning Tool Pressurizing Method
• Alignment
• Other parameters can be changed as necessary
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