[Presentation] SEMICON Taiwan 2026 TechXPOT “Break Technology and BSS Processing for SnB Singulation”
Mitsuboshi Diamond Industrial Co., Ltd. will give a presentation on SnB (Scribe and Break) technology at TechXPOT during SEMICON Taiwan 2026, held in Taipei, Taiwan, on Thursday, September 3, 2026.
Presentation Overview
- Speaker: Kumiko Murakami, Mitsuboshi Diamond Industrial Co., Ltd.
- Date and Time: Thursday, September 3, 2026, from 4:00 p.m. (20 minutes, including Q&A)
- Venue: TechXPOT Stage 3F, TaiNEX 2 (Booth: X0045)
- Title: “Break Technology and BSS Processing for SnB Singulation” (Presentation language: English)
1) SnB: Introduction to Scribe and Break and the mechanism of initial crack formation
2) Break technology: Comparison between table breaking and cantilever breaking (numerical analysis results)
3) BSS: Effectiveness of backside scribing in TEG singulation (numerical analysis and strength test results)
Event Overview (SEMICON Taiwan 2026)
Organizer: SEMI Taiwan
SEMICON Taiwan is not only a platform connecting Taiwan with the global microelectronics ecosystem, but also a bridge that facilitates seamless collaboration among industry, government, academia, and research institutions. While witnessing large-scale business collaboration, SEMICON Taiwan remains committed to its mission of “leading technology trends, driving technological innovation, and promoting collaboration,” and continues to provide a variety of channels and activities that meet companies’ marketing and promotional needs.
URL:
https://www.semicontaiwan.org/en
Related Links
SEMICON Taiwan 2026 Exhibition Announcement
【Contact for Inquiries】
Mitsuboshi Diamond Industrial Co., Ltd.
https://www.mitsuboshidiamond.com/
