SEMICON Taiwan 2026 Exhibition Announcement

MDI Taiwan Innovations Co., Ltd. a group company of Mitsuboshi Diamond Industrial Co., Ltd., will exhibit at “SEMICON Taiwan 2026,” to be held at the Taipei Nangang Exhibition Center from Wednesday, September 2 to Friday, September 4, 2026.

Exhibition Highlights

• SnB Technology for Compound Semiconductor Chip Singulation
  “Changing the Standard for SiC Cutting.”
  ― Proprietary SnB technology combining high precision, high productivity, and cost reduction ―
  
  SnB stands for “Scribe and Break,” a process used to separate hard and brittle materials such as glass. Building on the expertise we have cultivated in this technology since our founding, we have further advanced the process around our proprietary scribing wheel (cutting edge) and expanded its application to chip singulation processes for compound semiconductors, including SiC. By simply forming highly precise, fine lines on the wafer surface and combining this with the subsequent breaking process, this technology enables exceptionally high-quality chip separation with virtually no chipping. In addition, the modular design of DLP enables flexible installation and adaptation to a wide variety of customer production environments and line configurations. We invite you to discover our next-generation processing solution, which transforms conventional cutting processes while simultaneously achieving “high precision, high productivity, low cost, and reduced environmental impact.”
  

SEMICON Taiwan 2026 Event Information

【Venue and Booth】

Taipei Nangang Exhibition Center
TaiNEX Hall 1 and 2, Taipei, Taiwan
MDI Taiwan Booth No.: R7918　(4F, TaiNEX Hall 2)

【Dates and Hours】

Wednesday, September 2, 2026　10:00–17:00
Thursday, September 3, 2026　10:00–17:00
Friday, September 4, 2026　10:00–16:00

【Details】Exhibition Website

 We understand that you may have a busy schedule, but we sincerely hope you will take the opportunity to visit our booth.